Ultra-High Purity Tube Systems
For Semiconductor, Solar, Energy & Display. Ra ≤ 0.25 µm EP, particle-count validated, Cr/Fe oxide controlled.
- Ra ≤ 0.25 µm UHP electropolish
- Particle-count validated (Class 1)
- 316L-CS low-sulphur grade
- Cr/Fe oxide ratio controlled & logged
rensa Max
Ultra-High Purity Tubes & Fittings
Engineered for the most demanding cleanroom and process-gas environments. Standards: AMS 2700 · ASTM A270 S2 · ASTM A269 · SEMI F20.
Applications
Industries & Applications
Semiconductor
UHP process gas & chemical distribution in fabs.
Solar / Wafer
Ultra-clean silane & HF process lines for wafer fabs.
Energy / H₂
High-purity hydrogen and specialty gas distribution.
Display / LCD
UHP chemical delivery for flat panel and OLED lines.
R&D / Labs
Research-grade tubing for cleanroom lab environments.
Specifications
Tube & Fitting Specifications
All rensa Max products are manufactured under controlled cleanroom-grade conditions.
| Parameter | Tubes | Fittings |
|---|---|---|
| Standard | AMS 2700 · ASTM A270 S2 · SEMI F20 | AMS 2700 · SEMI F20 |
| Material Grade | 316L-CS (1.4435 · S ≤ 0.010%) | 316L-CS (matched grade) |
| Size Range | OD ¼″ – 2″ (DN6 – DN50) | ¼″ – 2″ (butt-weld & VCR/VCO) |
| Surface Finish | ID: UHP-EP ≤ 0.25 µm · OD: EP | ID: UHP-EP ≤ 0.25 µm · OD: EP |
| Cr/Fe Ratio | > 2.0 (XPS/AES verified) | > 2.0 (XPS/AES verified) |
| Particle Class | Class 1 (≥ 0.2 µm) post-flush | Class 1 post-flush |
| Weld Prep | Orbital-weld ready; square-cut | SEMI F19 end tolerances |
| Packaging | Nitrogen-purged, double-bagged | Nitrogen-purged, cleanroom-packed |
| Traceability | Heat no. marked, full MTR + EP data | Heat no. marked, full MTR + EP data |
Need Ra ≤ 0.05 µm (Mirror)? Multi-stage EP and mirror-finish passivation available on request for defence and nuclear applications.
Surface Finish
UHP Surface Finish Grades
All finishes profilometer-verified; Cr/Fe oxide ratio tested by XPS for EP and UHP grades.
| Grade | Process | Ra Target | Cr/Fe Ratio | Typical Application |
|---|---|---|---|---|
| BA | Bright anneal | ≤ 0.5 µm | — | General process |
| EP | Electropolish (ID + OD) | ≤ 0.38 µm | > 1.5 | Semiconductor process gas |
| UHP | High-definition EP (ID) | ≤ 0.25 µm | > 2.0 | Critical semiconductor / solar |
| Mirror | Multi-stage EP + passivation | ≤ 0.05 µm | > 2.5 (custom) | Extreme-purity lab & defence |
Quality Assurance
UHP QA & Traceability
Every rensa Max order is subject to four mandatory UHP checkpoints before despatch.
UHP Ra / Rz Profilometry
Surface roughness measured to ≤ 0.25 µm with calibrated stylus profilometer — batch recorded per SEMI F19.
Cr/Fe Oxide Ratio
Oxide chemistry verified by XPS / AES for every EP batch — Cr/Fe > 2.0 for UHP product lines.
Particle Count Validation
Particle-flush test to Class 1 (≥ 0.2 µm) performed post-EP, with counts recorded in the QA data pack.
Full UHP Documentation
MTR, PMI, Ra/Rz data, Cr/Fe ratio, particle count and EP bath log shipped with every order.
Every rensa Max order ships with a full UHP data pack — MTR, PMI, Ra/Rz data, Cr/Fe ratio, particle count log and EP bath records included.
Product Range
rensa Max Fittings Range
Butt-Weld Fittings
- Elbows 90° / 45°
- Equal & reducing tees
- Concentric reducers
- End caps
Face-Seal Fittings
- VCR® compatible bodies
- VCO® compatible bodies
- Hex nipples & unions
- Plug & cap fittings
Gas-Panel Components
- Straight connectors
- Tee & cross bodies
- High-flow elbows
- Purge / vent ports
Custom Fabrication
- Manifold assemblies
- Custom OD / WT
- Cleanroom-assembled sub-assemblies
- Nitrogen-purged packaging
Request a UHP qualification package
We supply full UHP data packs — Ra, Cr/Fe, particle count records and samples — aligned to your process spec and fab qualification requirements.